Dynex Releases Trench Gate IGBT Modules in Industry Standard Packages

16 October 2005

Posted: 16.10.05

Dynex Semiconductor, a leading power semiconductor technology company today announced the release of three new IGBT module product ranges at 1200V, 1700V and 3500V in single, halfbridge, chopper and dual switch circuit configurations for high reliability applications.

The 1200V and 1700V modules incorporate trench fieldstop technology while the 3500V modules feature soft punch through technology. Switching and conduction losses are significantly reduced in comparison to previous module ranges. In addition to the 200A to 2400A ratings presently offered Dynex will also offer 1200A dual and 3600A single switches with 1200V and 1700V ratings.

All modules are optimised for high thermal cycling and are available in industry standard footprint packages constructed with isolated metal matrix baseplates and AIN substrates.

Typical applications for the new modules will include high reliability inverters such as wind turbines and motor controllers, and railway traction drives.

For more information or to request product literature please contact Europower Components by clicking on the "contact" link shown.